MySTDF · Root Cause Intelligent Engine

From test data to evidence, decision, and action.

MySTDF combines interactive engineering analysis, AI-assisted root-cause intelligence, adaptive learning, and automated reporting in one local-first workflow.

Large STDF datasets Wafer and site intelligence AI-assisted evidence ranking Decision-ready reports
MySTDF · Intelligent Analysis Workspace AI ON
Wafer Yield97.84%Stable
Risk Tests123 high
Site Delta1.9%Site 4
Wafer PatternZ-score evidence
Yield TrendLot / wafer
Root-cause candidatesRanked evidence
  1. Site 4 distribution shiftHigh
  2. Continuity OS tailMedium
  3. Edge-ring wafer patternMedium
Built for semiconductor test engineering STDF ATE Wafer maps Yield Root cause Automation

Data to insight

Tester → MySTDF → AI → Alert → Action

Move beyond passive analysis toward a proactive engineering intelligence flow that connects test data, evidence, decisions, and follow-up action.

01Source

Tester

STDF, site, bin, parametric, wafer, and metadata inputs.

02Platform

MySTDF

Scalable conversion, indexing, visualization, and engineering analysis.

03Intelligence

AI

Pattern detection, correlation, upstream evidence, and candidate ranking.

04Response

Alert

Issue summary, confidence, evidence, and decision-ready notification.

05Outcome

Action

Recommended next checks, engineering follow-up, and report output.

24/7

Continuous monitoring ready

A foundation for scheduled conversion, analysis, reporting, and alerting.

Local-first

Keep data close to engineering

SQLite-based processing avoids loading complete multi-gigabyte datasets into memory.

Decision support

From result to explanation

Connect detected issues to root-cause candidates, supporting evidence, and next actions.

The engineering problem

Insight is often slower than the data.

Traditional workflows can be fragmented across scripts, spreadsheets, plots, and manual review. MySTDF brings the key evidence into one guided investigation flow.

Traditional workflow

Manual and reactive

  • Repeated data preparation
  • Disconnected analysis tools
  • Root-cause evidence gathered manually
  • Reports assembled after analysis
MySTDF workflow

Integrated and proactive

  • Structured local data foundation
  • Interactive multi-view verification
  • AI-assisted evidence ranking
  • Automated decision-ready output

3-layer intelligence architecture

AI + Learning + Auto Report

A practical architecture that converts raw data into engineering intelligence, then preserves knowledge and produces repeatable output.

01

AI Layer

Root Cause Intelligence

  • Correlation and pattern detection
  • Upstream evidence ranking
  • Wafer, site, bin, and parametric verification
  • Root-cause candidate confidence
02

Learning Layer

Adaptive Knowledge

  • User-defined role mapping
  • Flexible keyword matching
  • Persistent knowledge configuration
  • Auto refresh without model retraining
03

Auto Report Layer

Decision Output

  • Automated issue summary
  • Root cause, why, and evidence
  • Recommended next action
  • Presentation-ready reporting
DataIntelligenceDecisionAutonomous Action

Auto Report

Decision-ready output, not just exported charts.

The report structure follows the way engineers communicate a problem: issue, root cause, evidence, and action.

IssueRoot CauseEvidenceAction
MySTDF AUTO REPORTWafer Issue Summary
Decision Ready
Yield92.8%
Top FailHB 103
AI RiskHigh
Confidence0.86

1. Issue Summary

Yield loss is concentrated on Site 4 with a repeated edge-ring wafer signature.

2. Root Cause + Why

Primary candidate: site-dependent contact or hardware path instability.

3. Evidence

4. Recommended Action

Verify Site 4 contact path, compare continuity distributions, and review affected samples.

Interactive engineering analysis

Click to discover. Instantly understand.

Move from a wafer signature to the supporting tables, distributions, sites, tests, and samples.

WM

Wafer Map Intelligence

Fail maps, parametric maps, spatial signatures, edge patterns, and abnormal clusters.

TS

Test & Site Analysis

TSR, site distributions, fail rate, Cpk, mean shifts, and cross-wafer comparisons.

CR

Correlation & Sanity

Upstream relationships, distribution changes, suspicious specs, and multi-view verification.

FA

Failure Localization

Trace control-table findings to wafers, coordinates, samples, pins, and evidence views.

DB

Scalable Data Foundation

Chunked STDF conversion, per-file SQLite databases, and hot project catalogs.

RP

Automated Reporting

Repeatable summaries for engineering review, collaboration, and escalation.

Adaptive learning engine

User-driven intelligence without constant retraining.

Engineering knowledge can be added through role mapping and flexible keyword rules, then stored as a persistent knowledge configuration.

User

Define test roles and engineering meaning.

Mapping

Connect keywords and tests to reusable knowledge.

Analysis

Apply learned context during root-cause evaluation.

Improvement

Persist updates and refresh future analyses.

Role Mapping

User-defined classification for continuity, supply, scan, analog, IDDQ, and other test families.

Keyword Matching

Flexible, case-insensitive rules that can evolve without rebuilding the model.

Persistent Knowledge

Reusable JSON-based knowledge that remains available across future projects.

Future-ready foundation

Built for AI Agent, MCP, and automation initiatives.

The same structured data, analysis services, and decision outputs can support scheduled monitoring, CLI workflows, web dashboards, agent tools, and autonomous follow-up.

CLIHTML DashboardMCPAI AgentAlerts24/7 Automation

About BestEDA

Building the foundation for AI-driven engineering intelligence.

BestEDA develops focused tools for semiconductor test-data conversion, wafer analytics, root-cause investigation, adaptive engineering knowledge, and automated reporting.

The goal is to help engineers spend less time preparing and assembling data, and more time making traceable, confident decisions.

Start a discussion

Bring your STDF analysis use case.

Product inquiries, technical discussions, collaboration, and MySTDF demonstrations.